ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 is a solventless epoxy adhesive that
develops high bond strength when cured at temperatures as
low as 100 to 130¡ãC. It combines flexibility at low temperatures
plus high peel and tensile shear strength over a broad
temperature range.
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