ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505
ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505
ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505 ÀÖÌ© 3505
ÀÖÌ© 3505 is a one part, heat curable epoxy. It is
designed for use as a reworkable CSP(FBGA) or BGA underfill
for protection of solder joint against mechanical stress when
used for hand held electronics devices.
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