ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517
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ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517 ÀÖÌ© 3517
ÀÖÌ© 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP (FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.
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