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技术服务热线：021-51693135 / 021-22818476
PRODUCT DESCRIPTION
Thermstrate® TC is a phase change thermal interface material
suitable for use between a heat sink and a variety of heat
dissipating components. This product is supplied as a dry
compound in bar form, packaged in a unique easy to use
applicator, which flows in the installation at the phase change
temperature and conforms to the surface features of the heat
sink and component. Upon flow, air is expelled from the
interface, reducing thermal impedance and the material
performs as a highly efficient thermal transfer medium.
Thermstrate TC is a convenient alternative to die cut preforms.
Custom parts of the equivalent preformed material,
Thermstrate 2000, are available upon request for a wide range
of applications.
TYPICAL APPLICATIONS
Micro processors, hybrid power modules, solid state relays,
power transistors, power modules, IGBT’s, RF components
etc. Typically used between any heat dissipating electrically
isolated component and a heat sink or thermal solution.
MATERIAL PROPERTIES
One application of Thermstrate TC results in a compound
coating thickness of approximately 0.25 mils (0.00635mm).
Data for this coating thickness is provided below.
Storage
Prior to assembly products shall ideally be stored in a cool, dry
location in original packaging at temperatures below 40°C
(104°F).
产品描述
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